New Model: BFTADN1-N97-N or BFDADN1-N97-N
Intel® Apollo Lake Processor, DDR3L SODIMM up to 8GB
Features
1. Intel® Apollo Lake Processor
2. Supports 1 * DDR3L-1866MHz SO-DIMM up to 8GB
3. 2 * USB2.0, 4* USB3.0, 2* DP, 2* RJ45, Micro SD slot, 1* RS232 (RJ45 Type)
4. DC 12V_60W Adapter
New Model: BFTADN1-N97-N or BFDADN1-N97-N
Socket-Q170
Intel® LGA1151 CPU, DDR4 2133MHz up to 32GB, 4 * USB3.0, 1 * HDMI, 2 * DP, 2 * LAN Features
- Fanless Black Aluminum Enclosure
- Support Intel LGA1151 Socket 6th & 7th generation Pentinum, Core i3, i5, i7 Processors (TDP 35W)
- Supports DDR4-2133MHz SODIMM up to 32GB
- Supports up to 3 Displays, 1* HDMI, 2* DP
- 1* 2.5” SATAIII 6Gb/s Internal Drive bay
- 1* full-size Mini PCIe slot
- Support Onboard TPM IC (option)
- 4* USB3.0, 2* USB2.0, 2* RS232/422/485
- Watchdog Timer, 120W 19V AC Adapter
EOL
AiSEMI simple - Fast Body Temperature Measurement System
Features
1. Measurement at 0.5m in 1 second
2. 256-point Array Accurate Detection
3. Touch-Free Social Distance
4. Support Multi-lingual Voice Prompts
SoC-STM32
AiSEMI multi - AI Thermal Imaging Multi-person Temperature Screening System
Features
1. AI Face Recognition and Tracking Technology
2. Infrared Thermal Imaging Technology
3. Support Advertisement Mode
4. Synchronous Temperature Screening for 8~10 People
5. Wide-ranging non-contact Temperature Screening
6. Abnormal Warning Function
7. HBJC921R3288-2H System is required
SoC-RK1808
AiSEMI ONE LITE - Smart Temperature Screening and Digital Signage System
Features
1. World Premiere Smart Temperature Screening and Digital Signage System with VOx (Vanadium Oxide) Sensor Element
2. Temperature Screening at 1.5m in 0.6 second
3. Support High Temperature Warning
4. 10.1″ Display and Digital Signage System
5. Support Advertisement Mode
SoC-RK1808
AiSEMI one vox - Smart Attendance and Temperature Screening System
Features
1. World Premiere Smart Attendance System and Temperature Screening System with VOx (Vanadium Oxide) Sensor Element
2. Fast Response, High Accuracy and Good Temperature Stability
3. On-Premise Network to Secure Personal Data
4. Efficient Attendance System
5. Face Recognition Access Control System
6. Support Multi-door (6 doors) Access Control Management
7. 10.1" Welcome Board and Signage
8. 10,000 Face Database and 100,000 Measurement Data Capacity
9. Support Multi-Factor Authentication
9 Support Multi-Factor Authentication
SoC-1605B
AMD™ RYZEN™ Embedded V-Series V1605B CPU, DDR4 up to 32GB
Features
1. AMD™ RYZEN™ V1605B 2.0GHz/QC Core Processor
2. 2* DDR4 2400MHz up to 32GB
3. 2* Realtek® RTL8111H GbE
4. 2* SATA III (6Gb/s), 1* M.2 M key (PCIe x2)
5. 4* DP(DP0 Co-lay eDP, DP1 Co-lay LVDS)
6. 2* RS232/422/485, 4* RS232, 2* USB3.2 (Gen1), 8* USB2.0
7. 1* M.2 E key, 1* M.2 B key support 4G/5G Module
8. 12~28V DC-in
9. MINI ITX Form Factor (170 *170 mm)
10. JLI1U-22 support TPM2.0 (option)
SoC-Others
Ethernet Ports for JNF9HG-2930
Features
1. PCIe x 1, 2.0 (5GT/s) rate
2. Chipset: Asmedia 1806 PCIe switch, Intel i211AT GbE
3. Feature: 4 * Intel GbE, support Wake on LAN S1/S3/S4/S5 mode
4. Application: VPN, UTM Network bandwidth controller, Mail spam
5. Dimension: 170 * 81.9 mm
SoC-N6210
PICO-ITX size Motherboard with Intel® Elkhart Lake Processor, support DDR4 up to 32GB, 1* M.2 (M-key), 1* M.2 (E-key), support dual display (1* HDMI and 1*eDP)
Features
1. Intel® Elkhart Lake SoC Processor
2. 1* DDR4 3200MHz SO-DIMM up to 32GB
3. 1* HDMI, 1* eDP
4. 1* COM, 2* USB3.1 (Gen.2) Type-A, 2* USB2.0, 1* USB3.1 (Gen.2) Type-C
5. 1* M.2 M-key 2242 (SATA/PCIe Gen.3 x2 interface) support NVME, 1* M.2 E-key 2230 (USB2.0/PCIe Gen.3 x1 interface)
6. Onboard 64GB eMMC option (MP01-62104)
7. 12V DC-in
SoC-1135G7
Intel® Gen. 11 Tiger Lake-UP3 SoC Processor, 1135G7 chipset, M.2 PCIe 4.0 x4 supports NVMe, 4* COM, 2* USB3.2 (Gen2), 1* GbE, 1* 2.5GbE
Features
1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W)
2. 2* DDR4 3200MHz SO-DIMM up to 64GB
3. 1* Intel i219-LM GbE, 1* Intel i225-V 2.5GbE
4. 1* HDMI2.0, 1* eDP, 1* LVDS
5. 2* RS232, 2* RS232/422/485, 2* USB3.2 (2代), 5* USB2.0
6. 1* SATAIII, 1* SIM card slot
7. 1* M.2 M-key (2242/2280), PCIe 4.0 x4 interface supports NVMe
8. 1* M.2 E-key (2230), USB2.0/PCIe x1 interface supports CNVi
9. 1* M.2 B-key (3042/3052/6570), USB3.2/USB2.0 /PCIe x1 interface supports 4/5G Module
10. 1* Mixture Header (2* UART, 2* USB2.0, 1* LPC, 1* GPIO)
11. Onboard TPM 2.0 (JLZ0FV-92 option)
12. 12~36V DC-in
SoC-6305E
Intel® Gen. 11 Tiger Lake-UP3 SoC Processor, 6305E chipset, M.2 PCIe 4.0 x4 supports NVMe, 4* COM, 2* USB3.2 (Gen2), 1* GbE, 1* 2.5GbE
Features
1. Intel® Tiger Lake-UP3 SoC Processor (TDP 15W)
2. 2* DDR4 3200MHz SO-DIMM up to 64GB
3. 1* Intel i219-LM GbE, 1* Intel i225-V 2.5GbE
4. 1* HDMI2.0, 1* eDP, 1* LVDS
5. 2* RS232, 2* RS232/422/485, 2* USB3.2 (Gen2), 5* USB2.0
6. 1* SATAIII, 1* SIM card slot
7. 1* M.2 M-key (2242/2280), PCIe 4.0 x4 interface supports NVMe
8. 1* M.2 E-key (2230), USB2.0/PCIe x1 interface supports CNVi
9. 1* M.2 B-key (3042/3052/6570), USB3.2/USB2.0 /PCIe x1 interface supports 4/5G Module
10. 1* Mixture Header (2* UART, 2* USB2.0, 1* LPC, 1* GPIO)
11. Onboard TPM 2.0 (JLZ0FV-02 option)
12. 12~36V DC-in
SoC-8265U
Intel® Whiskey Lake-U CPU, DDR4 up to 64GB, 1* GbE, 1* 2.5GbE, support Wide Voltage 12~36V DC-in
Features
1. Intel® 8th Gen Whiskey Lake-U 1.6GHz/QC Core MCP Processor
2. 2* DDR4 2400MHz, up to 64GB
3. 1* Intel®I219LM GbE, 1* Intel® i225-V 2.5GbE
4. 1* SATA III (6Gb/s), 1* M.2 (M-key), 1* M.2 E-key Support CNVi, 1* M.2 B-key Support 4G/5G Module
5. 1* HDMI/DP + 1* eDP
6. 2* RS232/422/485, 2* USB3.0, 3* USB2.0
7. 12~36V DC in
8. 3.5” Form Factor (146 *102 mm)
9. JLF0DV-42 support TPM2.0 (option)
SoC-5205U
Intel® Comet Lake-U Celeron 5205U CPU, DDR4 up to 64GB, 1* GbE, 1* 2.5GbE, support Wide Voltage 12~36V DC-in
Features
1. Intel® 10th Gen Comet Lake Celeron 5205U 1.9GHz/DC Core MCP Processor
2. 2* DDR4 2400MHz, up to 64GB
3. 1* Intel®I219LM GbE, 1* Intel® i225-V 2.5GbE
4. 1* SATA III (6Gb/s), 1* M.2 (M-key), 1* M.2 E-key Support CNVi, 1* M.2 B-key Support 4G/5G Module
5. 1* HDMI/DP + 1* eDP
6. 2* RS232/422/485, 2* USB3.0, 3* USB2.0
7. 12~36V DC in
8. 3.5” Form Factor (146 *102 mm)
9. JLF0DV-E2 support TPM2.0 (option)
Socket-Q370
Intel® LGA1151 CPU, DDR4 2400/2666MHz up to 64GB
Features
1. Fanless Black Aluminum Enclosure
2. Support Intel LGA1151 Coffee Lake Processors
3. Supports DDR4 2400/2666MHz SODIMM up to 64GB
4. Supports up to 3 Displays, 1* HDMI, 2* DP
5. 1* 2.5” SATAIII 6Gb/s Internal Drive bay
6. 1* M.2(M-key, 2242/2260/2280, Support NVMe) slot for SSD
7. Support onboard TPM 2.0
SoC-J3455
Intel® Apollo Lake SoC Processor, DDR3L 1866MHz up to 8GB
1. Intel® Apollo Lake SoC Processor (J3455)
2. 1 * SO-DIMM DDR3L 1866MHz up to 8GB
3. 4 * USB3.0, 2 * COM, 2 * HDMI, 1 * Audio, 2 * RJ45
4. Product Dimension: 185 x 165 x 48 mm
5. DC-12V_60W Lockable Adapter
6. TPM2.0 (option)
SoC-RK3399
Rockchip® RK3399 ARM SoC, 1* HDMI, 2* USB3.0, 6* USB2.0, 1* RJ45
Features
1. Rockchip® ARM Cortex A72 (Dual core) + Cortex A53 (Quad core) RK3399 SoC Processor
2. Onboard 2GB 1333MHz DDR3L DRAM
3. Onboard 16GB EMMC
4. 1* HDMI, 2* USB3.0, 6* USB2.0, 1* GbE, 1* Audio Jack, 1* DC Jack, 1* Power Button
5. M/B Form Factor: 3.5” SBC (148x102mm)
6. 1* 12V DC in
7. Support Android 7.1, Debian9.0
SoC-RK3399
Rockchip® RK3399 ARM SoC, 1* HDMI, 2* USB3.0, 6* USB2.0, 2* RJ45
Features
1. Rockchip® ARM Cortex A72 (Dual core) + Cortex A53 (Quad core) RK3399 SoC Processor
2. Onboard 2GB 1333MHz DDR3L DRAM
3. Onboard 16GB EMMC
4. 1* HDMI, 2* USB3.0, 6* USB2.0, 1* GbE, 1*10/100Mbps LAN, 1* Audio Jack, 1* DC Jack, 1* Power Button
5. M/B Form Factor: 3.5” SBC (148x102mm)
6. 1* 12V DC in
7. Support Android 7.1, Debian9.0
SoC-1135G7
Aluminum Die-Cast Panel PC series, 21.5" TFT Fanless Touch Panel Computer with Intel® Tiger Lake i5-1135G7 2.4GHz Quad Cores Processor
Features
1. 21.5” 250 nits TFT LCD with LED backlight
2. 10-points Multi Capacitive Touch
3. Support Open frameless design
4. Aluminum Die-Cast Panel PC series, Easy HDD and DARM installation, cableless design
5.12-36V DC-in, with Electrical Over Stress (EOS) and OVP design
6. Front bezel meets IP65-rated protection
7. VESA Support 100x100mm
SoC-J3455
Intel® Apollo Lake processor, DDR3L-1866MHz up to 8GB
Features
1. Intel® Apollo Lake J3455 SoC Processor
2. 1 * DDR3L 1866MHz SO-DIMM up to 8GB
3. 2 * USB3.0, 6 * GbE, 1 *RS232(RJ45 type)
4. M/B Form Factor: Mini ITX (170x170mm)
5. 1U 250W FLEX POWER
6. TPM2.0 (option)
SoC-J6412
Intel® Elkhart Lake SoC processor, DDR4 up to 32GB, 2* HDMI, 12~24V DC-in
Features
1. Intel® Elkhart Lake SoC Processor (Default: J6412)
2. Support 1* DDR4 3200MHz SO-DIMM up to 32GB
3. Support 8* USB, 2* RJ45, 4* COM, 2* HDMI
4. All-aluminum body, produced by casting process
5. Support DC12~24V input
New Model: BFTADN1-N97-N or BFDADN1-N97-N
4 LAN Ports Fanless Network Appliance with Intel® Elkhart Lake SoC processor
Features
1. Intel® Elkhart Lake SoC Processor, Default: J6412
2. 1* 260-pin Dual-channel DDR4 3200MHz SODIMM Up to 32GB
3. 1* COM (RS232/422/485), 1* USB3.1 Gen.2, 3* USB2.0
4. 4* Intel® i225V 2.5GbE
5. 1* M.2 M-key, 2242/2280 (SATA/PCIe Gen.3 x2) support NVMe, 1* M.2 E-key, 2230 (USB2.0/PCIe Gen.3 x1), 1* M.2 B-key, 3042/3052 (USB3.1), 1* SIM card slot
New Model: BFTADN1-N97-N or BFDADN1-N97-N
SoC-3955U
4 LAN Ports Fanless Network Appliance with Intel Skylake/Kaby Lake U-Series SoC Processor
Features
1. Intel® Skylake/Kabylake U-Series SoC Processor, Default: 3955U
2. 1* 260-pin Dual-channel DDR4 2133MHz SODIMM Up to 16 GB
3. 4* Ethernet Ports
4. 1* Full size Mini-SATA Socket (SATA + USB Signal)
5. 2* Mini PCIe Slots (1* full size, 1* half size)
6. 1* SIM card holder
7. Supports on board TPM2.0 (option)
8. 1* RS232 Console, 2* USB3.0, 2* USB2.0
New Model: HBJC150I225 or HBJC153I23
Desktop 4 /6 LAN Ports Network Appliance with Intel Skylake/Kabylake U-Series SoC Processor
Features
1. Intel® Skylake/Kabylake U-Series SoC Processor
2. 1* DDR4 2133MHz SODIMM Up to 16GB
3. 4 or 6 Ethernet Ports
4. 1* Full size Mini-SATA Socket (SATA + USB Signal)
5. 2* Mini PCIe Slots (1* full size, 1* half size)
6. Supports on board TPM2.0 (option)
7. 1* RS232 Console, 2* USB3.0
New Model: HBJC150I225 or HBJC153I23
SoC-J6412
Intel® Elkhart Lake SoC Processor, support DDR4 3200MHz up to 32GB
Features
1. Intel® Elkhart Lake SoC Processor
2. 1* DDR4 3200MHz SO-DIMM up to 32GB
3. 6* 10/100/1000/2500 Base-TX Ethernet Ports (support up to 2 pairs ByPass 2.5GbE option)
4. 1* USB 3.1 (Gen.2), 1* USB 2.0, 1* HDMI
5. 1* RS232 (RJ45 type), 2* COM, 1* GPIO
6. 1* M.2 E-key (2230), 1* M.2 B-key (3042), 1* SIM
7. 1* M.2 M-key (2242), 1* 2.5” SATA Device
8. 1U 250W FLEX POWER
SoC-J6412
Intel® Elkhart Lake SoC Processor, DDR4 3200MHz up to 32GB
Features
1. Intel Elkhart Lake SoC Processor
2. 1* DDR4 3200MHz SO-DIMM up to 32GB
3. 2* HDMI, 1* DP
4. 2* USB3.1 (Gen.2), 1* USB2.0, 2* USB TypeC, 2* RJ45, 1* Audio (MIC + Line-out)
5. M/B Form Factor: NUC (101x101mm)
6. DC12V_40W Adapter
SoC-J3455
Intel® Apollo Lake SoC processor, DDR3L up to 8GB, 1* M.2 (M-key), 1* M.2 (B-key), 2* 2.5GbE, 9~36V DC-in
Features
1. Intel® Apollo Lake SoC Processor
2. 1* DDR3L 1866MHz SO-DIMM up to 8GB
3. 2* 10/100/1000/2500 Base-TX Ethernet Ports
4. 1* HDMI, 1* eDP, 1* LVDS
5. 2* COM, 3* USB3.1 (Gen.1), 3* USB2.0
6. 1* M.2 M-key 2242, 1* M.2 B-key 3042 W/SIM card holder
7. 1* Full size Mini-PCIe, 1* SATA III (6Gb/s)
8. Support 9~36V DC-in
EOL
Mini-ITX Embedded Motherboard, Intel® 8th/9th Generation Core™ i7/ i5 /i3, Pentium® LGA1151 Socket Processor, 9~36V DC-in Power
Features
1. Intel® 8th/9th LGA 1151 Socket Core i7/i5/i3/ Pentium/Celeron Processor (Max. 65W TDP)
2. 2* DDR4 2400/2666MHz SO-DIMM up to 64GB
3. 1* GbE, 1* 2.5GbE
4. 1* HDMI (option with DP), 2* DP, 1* eDP
5. 2* COM (RS232/422/485), 6* USB3.1 (Gen.2), 4 * USB2.0
6. 1* PCIe x4 slot, 1* M.2 (M-Key 2242/2260/ 2280, support NVMe), 1* M.2 (E-key 2230)
7. 2* SATA III (6Gb/s) support RAID 0, 1
8. Support onboard TPM 2.0 (optional)
9. 9~36V DC-in Power Solution
EOL
Mini-ITX Embedded Motherboard, Intel® 8th/9th Generation Core™ i7/ i5 /i3, Pentium® LGA1151 Socket Processor, 9~36V DC-in Power
Features
1. Intel® 8th/9th LGA 1151 Socket Core i7/i5/i3/ Pentium/Celeron Processor (Max. 95W TDP)
2. 2* DDR4 2400/2666MHz SO-DIMM up to 64GB support ECC
3. 1* GbE, 1* 2.5GbE
4. 1* HDMI (option with DP), 2* DP, 1* eDP
5. 2* COM (RS232/422/485), 6 * USB3.1 Gen.2, 4 * USB2.0
6. 1* PCIe x4 slot, 1* M.2 (M-Key 2242/2260/ 2280, support NVMe), 1* M.2 (E-key 2230)
7. 2* SATA III (6Gb/s) support RAID 0, 1
8. Support onboard TPM 2.0 (optional)
9. 9~36V DC-in Power Solution
SoC-J6412
Intel® Elkhart Lake SoC Processor, 4* 2.5GbE, 1* COM (RJ45 type), 1* HDMI, 2* USB3.1
Features
1. Intel® Elkhart Lake SoC Processor
2. 1 * DDR4 3200MHz SODIMM up to 32GB
3. 4 * 2.5GbE
4. Support TPM2.0
5. 2 * USB , 1* HDMI, 1 * COM (RJ45 type)
6. 1 * M.2-2242, 1 * M.2-2230, 1 * M.2-3042
7. 12V DC-in
SoC-5205U
Intel® Comet Lake-U Series SoC Processor, Support DDR4 up to 64GB, Multiple COM port, 2* RJ45, support Intel CNVi, Support Wide Voltage 9~24V DC-in
Features
1. Intel® Comet Lake 5205U (Dual Core, 1.9GHz) SoC Processor (TDP 15W)
2. 2* DDR4 2400MHz SO-DIMM up to 64GB
3. 1* GbE, 1* 2.5GbE
4. 1* HDMI, 1* DP, 1* eDP, 1 * 24-bits Dual CH LVDS
5. 6* COM (COM1 support RS232/422/485), 4* USB3.1 Gen.1, 4* USB2.0 (1 Vertical type connector)
6. 1* M.2 M-key (2242/2280, SATA interface), 1* M.2 E-key (2230, PCIe interface) Support CNVi
7. 1* SATA III (6Gb/s)
8. Support TPM 2.0 (option)
9. Support Wide Voltage 9~24V DC-in