Socket-H610E

MI225H6100 Series

Mini-ITX Embedded Motherboard, 14th/13th/12th Gen (Raptor Lake-S/Alder Lake-S) Intel® LGA1700 Socket processor, Support Max. 65W TDPs under 180A, Support two DDR5 up to 96GB, three M.2 slot and one PCIe x16 slot Features 1. Intel® 14th/13th/12th LGA1700 Socket Processor (Max. 65W TDPs under 180A) 2. Intel® H610/H610E Chipset 3. 2* DDR5 4800MHz SO-DIMM up to 96GB 4. 1* 10/100/1000 Base-TX & 1* 10/100/1000/ 2500 Base-TX Ethernet Ports 5. 1* HDMI, 1* DP, 1* VGA, 1* LVDS/eDP 6. 6* COM (COM1 support RS232/422/485) 7. 2* USB3.2 Gen.2, 2* USB3.2 Gen.1, 5* USB2.0 8. 1* PCIe Gen.4 x16 slot, 1*M.2 M-Key (2280) support NVMe, 1*M.2 E-Key (2230) support CNVi, 1*M.2 B-key (3042) support 4G Module 9. 4* SATAIII (6Gb/s) 10. Support JetBIOS SW back up tool 11. Support Onboard TPM2.0 (MI225H6102 only)  Certification

Socket-R680E

MI225R6800 Series

Mini-ITX Embedded Motherboard, 14th/13th/12th Gen (Raptor Lake-S/Alder Lake-S) Intel® LGA1700 Socket processor, Support Max. 65W TDPs under 180A, Support two DDR5 up to 96GB, four M.2 slot and one PCIe x16 slot Features 1. Intel® 14th/13th/12th LGA1700 Socket Processor (Max. 65W TDPs under 180A) 2. Intel® R680E Chipset 3. 2* DDR5 4800MHz SO-DIMM up to 96GB support ECC 4. 1* 10/100/1000 Base-TX & 1* 10/100/1000/ 2500 Base-TX Ethernet Ports 5. 1* HDMI, 1* DP, 1* VGA, 1* LVDS/eDP 6. 6* COM (COM1 support RS232/422/485) 7. 6* USB3.2 Gen.2, 2* USB3.2 Gen.1, 3* USB2.0 8. 1* PCIe Gen.4 x16 slot, 1*M.2 M-Key (2280) support NVMe, 1*M.2 M-Key (2242) support NVMe, 1*M.2 E-Key (2230) support CNVi, 1*M.2 B-key (3042) support 4G Module 9. 4* SATAIII (6Gb/s) support RAID 0,1,5,10 10. Support JetBIOS SW back up tool 11. Support Onboard TPM2.0 (MI225R6802 only)   Certification

Socket-Q670E

MI225Q6700

Mini-ITX Embedded Motherboard, 14th/13th/12th Gen (Raptor Lake-S/Alder Lake-S) Intel® LGA1700 Socket processor, Support Max. 65W TDPs under 180A, Support two DDR5 up to 96GB, four M.2 slot and one PCIe x16 slot Features 1. Intel® 14th/13th/12th LGA1700 Socket Processor (Max. 65W TDPs under 180A) 2. Intel® Q670E Chipset 3. 2* DDR5 4800MHz SO-DIMM up to 96GB 4. 1* 10/100/1000 Base-TX & 1* 10/100/1000/ 2500 Base-TX Ethernet Ports 5. 1* HDMI, 1* DP, 1* VGA, 1* LVDS/eDP 6. 6* COM (COM1 support RS232/422/485) 7. 6* USB3.2 Gen.2, 2* USB3.2 Gen.1, 3* USB2.0 8. 1* PCIe Gen.4 x16 slot, 1*M.2 M-Key (2280) support NVMe, 1*M.2 M-Key (2242) support NVMe, 1*M.2 E-Key (2230) support CNVi, 1*M.2 B-key (3042) support 4G Module 9. 4* SATAIII (6Gb/s) support RAID 0,1,5,10 10. Support JetBIOS SW back up tool 11. Support Onboard TPM2.0 (MI225Q6702 only)  Certification

SoC-6305E

HPC170C-DCP6305E

Aluminum Die-Cast Panel PC series, 17.0" TFT Fanless Touch Panel Computer with Intel® Tiger Lake 6305E 1.8GHz Dual Cores Processor Features 1. 17.0” 350 nits TFT LCD with LED backlight 2. 10 points Multi Capacitive Touch 3. Support Open frameless design 4. A true Flat, easy to clean front surface with edge to edge design 5. Front IP65 for protection against water and dust 6. Aluminum Die-Cast Panel PC series, support for easy HDD and DARM installation 7. Support Cable less design 8. 12~36V DC-in, with Electrical Over Stress(EOS), OVP design 9. VESA Support 100x100mm  Certification

SoC-1135G7

HPC170C-DCP1135G7

Aluminum Die-Cast Panel PC series, 17.0" TFT Fanless Touch Panel Computer with Intel® Tiger Lake i5-1135G7 2.4GHz Quad Cores Processor Features 1. 17.0" 350 nits TFT LCD with LED backlight 2. 10 points Multi Capacitive Touch 3. Support Open frameless design 4. A true Flat, easy to clean front surface with edge to edge design 5. Front IP65 for protection against water and dust 6. Aluminum Die-Cast Panel PC series, support for easy HDD and DARM installation 7. Support Cable less design 8. 12 36V DC input Support, with Electrical Over Stress(EOS), OVP design 9. VESA Support 100x100mm  Certification

Socket-Q470E

JLA20-10S

Intel® Comet Lake-S Q470E, supports LGA1200 CPU (Max 125W), DDR4-2933MHz up to 128GB, without heatsink Features 1. Intel® LGA1200 Socket supports 10/11th Gen. Core Processor (Max 125W) 2. Intel® Comet Lake-S Q470E chipset 3. 4* DDR4 2933MHz up to 128GB 4. 1* Intel® i225-V 2.5GbE, 1* Intel® i219-LM GbE 5. 2* M.2 M Key (NVMe),1* M.2 E Key (CNVi), 1* M.2 B Key 6. 4* SATA III (6Gb/s), support Raid 0/1/5/10 7. 1* VGA, 1* HDMI, 1* DP 8. 2* RS232/422/485, 4* RS232, 4* USB3.2 (Gen.2), 1* USB3.2 (Gen.1), 6* USB2.0 9. 2* PCI-E x16, 5* PCI-E x 4 Slots 10. 2* CPU FAN, 2* System FAN 11. 24 + 8 Pin ATX Power Input 12. ATX Form Factor (305x244mm)  Certification

Intel® Kaby Lake-U Processor, Support two DDR4 2133MHz up to 32GB Features 1. Intel® Kaby Lake-U Processor 2. Support 2* SO-DIMM DDR4-2133 ,up to 32GB memory 3. 1* Full size Mini-PCIe shared with mSATA, 1* Half size Mini-PCIe, 1* mSATA shared with full size Mini-PCIe 4. 4* USB2.0, 4* USB3.0, 1* HDMI, 1* DP, 2* RJ45, 4* COM (Max), 1* MIC, 2* Line-out 5. DC-12V_60W Adapter 6. TPM 2.0 (option)  Certification

Socket-H420E

LA2H-H420E

Intel® Comet Lake-S H420E, supports LGA1200 CPU (Max 125W), DDR4 up to 64GB Features 1. Intel® LGA1200 Socket supports 10/11th Gen Core Processor (Max. 125W) 2. Intel® Comet Lake-S H420E chipset 3. 2* DDR4 2933/2666MHz up to 64GB 4. 1* Intel® i225-V 2.5GbE, 1* Intel® i219-LM GbE 5. 4* SATA III (6Gb/s, SATA4 CO-LAY M-key), 1* M.2 M-Key (SATA) 6. 1* VGA, 2* HDMI 7. 2* RS232/422/485, 4* RS232, 4* USB3.2(Gen1), 5* USB2.0 8. 1* PCI-E x16, 1* PCI-E x4, 5* PCI Slots 9. 1* CPU FAN, 2* System FAN 10. TPM 2.0 (可选) 11. 24 + 8 Pin ATX Power Input 12. ATX Form Factor (305 x 220mm)  Certification

SoC-10210U

JNF835V-10210U

Intel® Comet Lake-U Series SoC Processor, Support DDR4 up to 64GB, Multiple COM port, Type C USB3.1 (Gen2), Dual LAN, Support Intel CNVi Features 1. Intel® Comet Lake-U SoC Processor (TDP 15W) 2. 2* DDR4 2400MHz SO-DIMM up to 64GB 3. 1* GbE, 1* 2.5GbE 4. 1* HDMI, 1* DP, 1* eDP, 1 * 24-bits Dual CH LVDS 5. 6* COM (COM1 support RS232/422/485), 4* USB3.1 (Gen.2), 1* USB3.1(Gen.2) for Type C, 1* USB3.1 (Gen.2) for Vertical type, 3* USB2.0 6. 1* M.2 M-key (2242/2280, PCIe3.0 x4/SATA interface) support NVMe, 1* M.2 E-key (2230 w/ CNVi) 7. 1* SATA III (6Gb/s) 8. Support onboard TPM 2.0  Certification

SoC-RK3399

JR3399XH-2C

Rockchip® ARM Cortex A72+A53 RK3399, 2* RJ45 Features 1. Rockchip® ARM Cortex A72(Dual Core 1.8GHz) + Cortex A53(Quad Core 1.4GHz) 2. On board 1333/2GB DDR3L DRAM 3. On board 16G Flash ROM Max 64GB 4. Support WIFI and BlueTooth 5. 1* Realtek GbE, 1* Realtek 10/100Mbps LANP 6. 2* UART, 2* RS232, 2* USB3.0, 6* USB2.0, 1* OTG (Co-lay USB3.0) 7. 1* HDMI2.0, 1* eDP, 1* 24-bits Dual CH LVDS 8. Support 4K H.264/H.265 video decoding, up to 60fp 10bits coding 9. Support 1080P H.264 format video encoding 10. 1* Mini PCIe (Full size), 1* Micro SD Max. 256GB, 1* SIM Card Socket 11. Support Android 7.1, Debian9.0  

Intel® Elkhart Lake J6412 CPU, DDR4 up to 32GB, 6* 2.5GbE, support 12V DC-in Features 1. Intel® Elkhart Lake J6412 Processor 2. Support 1* DDR4 3200 up to 32GB 3. 6* Intel® I225-V 2.5GbE 4. 1* M.2 M-key (2242, SATA/PCIe Gen.3x2 interface) support NVMe 5. 1* M.2 E-key (2230, USB2.0/PCIe Gen.3 x1 interface) 6. 1* M.2 B-key (3042, USB3.1/PCIe Gen.3 x1 interface) 7. 1* USB3.1 (Gen.2), 1* USB2.0, 3* COM, 1* HDMI, 1* RS232(RJ45 TYPE) 8. Fan-less cooling design 9. Adapter DC12V_60W  Certification

SoC-Others

MPC270CW-DF69

27" IPS Fanless Touch Screen, in-cell Touch Technology Display Features 1. 27" 300 nits TFT LCD with LED backlight 2. LG in-cell 10-points Multi Capacitive Touch 3. Using in-cell Touch technology which combines the display and touch functions for small to large size applications, support High Touch Performance and matching accuracy 4. A true Flat and Slim Design, Clear Image, support Cover-Glass Elimination 5. 1* VGA, 1* HDMI, 1* DP input 6. Support Built-in Speakers 7. OSD Multilanguage function 8. Support Anti-glare and Anti-fingerprint 9. Front IP65 for protection against water and dust 10. Support VESA Mounting Certification

Socket-Q470E

LI22-Q470E

Intel® Comet Lake-S Q470E chipset, supports LGA1200 CPU (Max 65W), DDR4 up to 64GB Features 1. Intel® LGA1200 Socket supports 10/11th Gen Core Processor (Max 65W) 2. Intel® Comet Lake-S Q470E 3. 2* DDR4 3200/2933MHz up to 64GB 4. 1* Intel® i225-V 2.5 GbE, 1* Intel® i219-LM GbE 5. 1* M.2 M-Key (PCI-Ex4), 1* M.2 E-Key (CNVi/PCI-Ex1) 6. 4* SATA III (6Gb/s, support RAID 0/1/5/10), 1* PCI-E x16 slot 7. 1* VGA, 1* HDMI, 1* DP, 1* LVDS/eDP 8. 2* RS232/422/485, 4* RS232, 10* USB3.2 (Gen1), 3* USB2.0 9. Support Onboard TPM2.0 (LI22-Q470E2, option) 10. 24 + 4 Pin ATX Power Input 11. Mini-ITX Form Factor (170x170mm)  Certification

Socket-H420E

LI22-H420E

Intel® Comet Lake-S H420E chipset, supports LGA1200 CPU (Max 65W), DDR4 up to 64GB Features 1. Intel® LGA1200 Socket supports 10/11th Gen Core Processor (Max 65W) 2. Intel® Comet Lake-S H420E 3. 2* DDR4 2933/2666MHz up to 64GB 4. 1* Intel® i225-V 2.5 GbE, 1* Intel® i219-LM GbE 5. 1* M.2 M-Key (PCI-Ex4), 1* M.2 E-Key (PCI-Ex1) 6. 4* SATA III (6Gb/s), 1* PCI-E x16 slot 7. 1* VGA, 1* HDMI, 1* DP, 1* LVDS/eDP Output 8. 2* RS232/422/485, 4* RS232, 6* USB3.2 (Gen1), 3* USB2.0 9. LI22-H420E2 support Onboard TPM2.0 (option) 10. 24 + 4 Pin ATX Power Input 11. Mini-ITX Form Factor (170x170mm)  Certification

AMD RYZEN V1605B Processor, Support DDR4 2400MHz up to 32GB, Support 4* 4K Display, support wide voltage for Multiple Manufacturing application Features 1. AMD RYZEN V1605B 2.0GHz/QC Core Processor 2. 2* DDR4 2400MHz up to 32GB 3. 1* 2.5”SATA, 1* M.2 E-key, 1* M.2 M-key, 1* M.2 B-key 4. Support 4* DP 5. 2* COM (Max : 6* COM), 2* LAN, 2* USB3.2, 4* USB2.0, 1* Line in, 1* Line out, 1* Mic 6. Mini ITX Form Factor (170 *170 mm) 7. Support TPM2.0 (optional) 8. DC12~28V input  Certification

New Model: HBJC150I225 or HBJC153I23 Intel® 10th/11th LGA1200 Socket Processor, DDR4 3200 MHz up to 64GB Features 1. Intel® LGA1200 Socket support 10th/11th Gen CoreTM Processor 2. Support 2* DDR4 3200/2933MHz SO-DIMM up to 64 GB 3. 4* USB3.2 (Gen2), 2* USB3.2 (Gen1), 2* USB2.0, 2* COM, 1* HDMI , 1* DP, 1* VGA, 2* RJ45, 1* MIC, 1* Line out , Line in 4. M/B Form Factor : Mini ITX (170x170mm) 5. 1U FLEX 250W ATX Power 6. Support TPM2.0 (option)  New Model: HBJC150I225 or HBJC153I23  Certification

Socket-H610

MM10-H6100 Series

Intel H610 chipset supports LGA 1700 socket for the Intel® 14th/13th/12th Gen (Raptor Lake-S/Alder Lake-S) i9/i7/i5/i3 processor with DDR5 up to 96GB memory, Support Max. 125W TDPs under 240A Features 1. Intel® 14th/13th/12th LGA1700 Socket Processor (Max. 125W TDPs under 240A) 2. 2* DDR5 4800MHz/4000MHz UDIMM up to 96GB 3. 2* GbE 4. 2* HDMI, 1* DP, 1* VGA 5. 6* COM (COM1 support RS232/422/485) 6. 2* USB3.2 Gen.2, 1* USB3.2 Gen.1, 11* USB2.0 7. 1* PCIe x16 slot, 2* PCIe x4 slot, 1* M.2 M-Key (2242/2260/2280/22110, SATA interface), 1* M.2 E-Key (2230, USB2.0 interface) support CNVi 8. 3* SATAIII (SATA2 support SATA DOM) 9. Support onboard TPM 2.0 (MM10-H6102 only)  Certification

Socket-Q670E

MM10-Q6700 Series

Intel Q670E chipset supports LGA 1700 socket for the Intel® 14th/13th/12th Gen (Raptor Lake-S/Alder Lake-S) i9/i7/i5/i3 processor with DDR5 up to 192GB memory, Support Max. 125W TDPs under 240A Features 1. Intel® 14th/13th/12th LGA1700 Socket Processor (Max. 125W TDPs under 240A) 2. 4* DDR5 4800MHz/4000MHz UDIMM up to 192GB 3. 2* GbE, 1* 2.5GbE 4. 2* HDMI, 1* DP, 1* VGA 5.6* COM (COM1 support RS232/422/485), 6* USB3.2 Gen.2, 1* USB3.2 Gen.1, 11* USB2.0 6. 1* PCIe Gen.5x16 slot, 3* PCIex4 slots (2 x Gen.3, 1 x Gen.4), 1*M.2 M-Key 2242/2260/2280/22110 (SATA/PCIex4 interface) support NVMe, 1* M.2 E-Key (2230, USB2.0/ PCIex1 interface) support CNVio 7. 3* SATAIII (6Gb/s) support RAID 0, 1, 5, 10 (Support RAID 10 by using additional M.2 M-Key with SATA interface; SATA2 support SATA DOM) 8. Support onboard TPM 2.0 (MM10-Q6702 only)  Certification

SoC-J6412

HB368F21-6412-W

Intel® Elkhart Lake SoC Processor, DDR4 3200MHz up to 32GB Features 1. Intel Elkhart Lake SoC Processor 2. 1* DDR4 3200MHz SO-DIMM up to 32GB 3. 2* USB3.1 (Gen.2), 4* USB2.0, 2* RJ45,1* Audio (MIC + Line-out), 1* Line-IN, 3* DP, 2* COM, 1* GPIO 4. Support TPM2.0 (option) 5. 160.2*106*43.5 mm 6. DC12V_60W Adapter  Certification

Intel® Elkhart Lake SoC Processor, DDR4 3200MHz up to 32GB Features 1. Intel Elkhart Lake SoC Processor 2. 1* DDR4 3200MHz SO-DIMM up to 32GB 3. 2* USB3.1 (Gen.2), 4* USB2.0, 2* RJ45,1* Audio (MIC + Line-out), 1* Line-IN, 3* DP, 2* COM, 1* GPIO 4. Support TPM2.0 (option) 5. 160.2*106*27 mm 6. DC12V_40W/60W Adapter (BY Model)  Certification

SoC-N6210

HB368F21-6210-S

Intel® Elkhart Lake SoC Processor, DDR4 3200MHz up to 32GB Features 1. Intel Elkhart Lake SoC Processor 2. 1* DDR4 3200MHz SO-DIMM up to 32GB 3. 2* USB3.1 (Gen.2), 4* USB2.0, 2* RJ45,1* Audio (MIC + Line-out), 1* Line-IN, 3* DP, 2* COM, 1* GPIO 4. Support TPM2.0 (option) 5. 160.2*106*27 mm 6. DC12V_40W Adapter  Certification

SoC-6305E

HPC270C-DCP6305E

Aluminum Die-Cast Panel PC series, 27.0" TFT Fanless Touch Panel Computer with Intel® Tiger Lake 6305E 1.8GHz Dual Cores Processor Features 1. 27.0" 300 nits TFT LCD with LED backlight 2. LG in-cell 10-points Multi Capacitive Touch 3. A true Flat and Slim Design, Clear Image, support Cover-Glass Elimination 4. Front IP65 for protection against water and dust 5. Support for easy HDD and DARM installation 6. Aluminum Die-Cast Panel PC series, support Cable less design 7. 12-36V DC-input Support, with Electrical Over Stress (EOS), OVP design 8. VESA Support 100x100mm Certification  Certification

SoC-1135G7

HPC270C-DCP1135G7

Aluminum Die-Cast Panel PC series, 27.0" TFT Fanless Touch Panel Computer with Intel® Tiger Lake i5-1135G7 2.4GHz Quad Cores Processor Features 1. 27.0" 300 nits TFT LCD with LED backlight 2. LG in-cell 10-points Multi Capacitive Touch 3. A true Flat and Slim Design, Clear Image, support Cover-Glass Elimination 4. Front IP65 for protection against water and dust 5. Support for easy HDD and DARM installation 6. Aluminum Die-Cast Panel PC series, support Cable less design 7. 12-36V DC-input Support, with Electrical Over Stress(EOS), OVP design 8. VESA Support 100x100mm Certification  Certification

SoC-J6412

HPC156SC-FP6412

15.6" TFT FanLess Touch Panel Computer with Intel® Elkhart Lake J6412 2.0GHz Quad Cores Processor Features 1. 15.6" 250 nits high brightness TFT LCD with LED backlight 2. 10-points Multi Capacitive Touch 3. Cable less, Streamlined enclosure for highly efficient heat dissipation. Enclosed in robust aluminum casings 4. Edge-to-edge narrow bezel design and Fanless cooling system 5. Design for easy Wall mount, Panel Mount, VESA Mount installation 6. A true Flat, easy-to-clean front surface with edge-to-edge design 7. USB2.0 Support Lock Device 8. Front IP65 for protection against water and dust 9. 12-28V DC-input Support, with EOS, OVP design 10. Support TPM2.0 (HPC156SC-FP6412T2 only) 11. VESA Support 100x100mm   Certification

SoC-J6412

HPC150GR-HD6412

15.0" TFT FanLess Touch Panel Computer with Intel® Elkhart Lake J6412 2.0GHz Quad Cores Processor Features 1. 15.0" 350 nits high brightness TFT LCD with LED backlight 2. 5 Wire Resistive Touch/Anti-Reflection Protection Glass 3. Cable less, Streamlined enclosure for highly efficient heat dissipation Enclosed in robust aluminum casings 4. Strong solid aluminum frame design and Fanless cooling system 5. Support Open frameless design 6. Design for easy Wall mount, Panel Mount, VESA Mount installation 7. A true Flat, easy-to-clean front surface with edge-to-edge design 8. USB2.0 Support Lock Device 9. Front IP65 for protection against water and dust 10. 12-28V DC-input Support, with EOS, OVP design 11. Support TPM2.0 (HPC150GR-HD6412T2 only) 12. VESA Support 100x100mm   Certification

SoC-J6412

HPC104GR-HD6412

10.4" TFT FanLess Touch Panel Computer with Intel® Elkhart Lake J6412 2.0GHz Quad Cores Processor Features 1. 10.4" 400 nits high brightness TFT LCD with LED backlight 2. 5 Wire Resistive Touch/Anti-Reflection Protection Glass 3. Streamlined enclosure for highly efficient heat dissipation Enclosed in robust aluminum casings 4. Strong solid aluminum frame design and Fanless cooling system 5. Support Open frameless design 6. Design for easy Wall mount, Panel Mount, VESA Mount installation 7. A true Flat, easy-to-clean front surface with edge-to-edge design 8. SB2.0 Support Lock Device 9. IO Ports designed for easy connection 10. 12-28V DC-input Support, with EOS, OVP design 11. Support TPM2.0 (HPC104GR-HD6412T2 only) 12. VESA Support 100x100mm  Certification

SoC-J6412

HPC215SC-FP6412

21.5" TFT FanLess Touch Panel Computer with Intel® Elkhart Lake J6412 2.0GHz Quad Cores Processor Features 1. 21.5" 250 nits high brightness TFT LCD with LED backlight 2. 10-points Multi Capacitive Touch 3. Cable less, Streamlined enclosure for highly efficient heat dissipation. Enclosed in robust aluminum casings 4. Edge-to-edge narrow bezel design and Fanless cooling system 5. Design for easy Wall mount, Panel Mount, VESA Mount installation 6. A true Flat, easy-to-clean front surface with edge-to-edge design 7. USB2.0 Support Lock Device 8. Front IP65 for protection against water and dust 9. 12-28V DC-input Support, with EOS, OVP design 10. Support TPM2.0 (HPC215SC-FP6412T2 only) 11. VESA Support 100x100mm  Certification

SoC-J6412

HPC170GR-HD6412

17.0" TFT FanLess Touch Panel Computer with Intel® Elkhart Lake J6412 2.0GHz Quad Cores Processor Features 1. 17.0”350 nits high brightness TFT LCD with LED backlight 2. 5 Wire Resistive Touch/Anti-Reflection Protection Glass 3. Cable less, Streamlined enclosure for highly efficient heat dissipation Enclosed in robust aluminum casings 4. Strong solid aluminum frame design and Fanless cooling system 5. Support Open frameless design 6. Design for easy Wall mount, Panel Mount, VESA Mount installation 7. A true Flat, easy-to-clean front surface with edge-to-edge design 8. USB2.0 Support Lock Device 9. Front IP65 for protection against water and dust 10. 12-28V DC-input Support, with EOS, OVP design 11. Support TPM2.0 (HPC170GR-HD6412T2 only) 12. VESA Support 100x100mm  Certification

SoC-J6412

HPC101SC-FP6412

10.1" TFT FanLess Touch Panel Computer with Intel® Elkhart Lake J6412 2.0GHz Quad Cores Processor Features 1. 10.1" 400 nits high brightness TFT LCD with LED backlight 2. 10-points Multi Capacitive Touch 3. Cable less, Streamlined enclosure for highly efficient heat dissipation. Enclosed in robust aluminum casings 4. Edge-to-edge narrow bezel design and Fanless cooling system 5. Design for easy Wall mount, Panel Mount, VESA Mount installation 6. A true Flat, easy-to-clean front surface with edge-to-edge design 7. USB2.0 Support Lock Device 8. Front IP65 for protection against water and dust 9. 12-28V DC-input Support, with EOS, OVP design 10. Support TPM2.0 (HPC101SC-FP6412T2 only) 11. VESA Support 100*100mm  Certification

Intel® Bay Trail N2930 SoC Processor 1.83GHz, DDR3L 1333MHz up to 8GB Features 1. NUC Form Factor (101mm X 101mm) Design for Fanless System 2. 1 * SO-DIMM DDR3L 1333MHz up to 8GB 3. Supports 9V~24V DC jack on back panel for external power supply 4. 2* HDMI, 2* GbE, 1* 2.5” SATA bay 5. Provides DC-12V_3.3A_40W Adapter  Certification