Showing 1–30 of 168 results

x86 Board

SoC-N97

Blessing ABC

Mini-ITX with Intel® Processor N-series Processors (formerly Alder Lake-N) Features 1. 1 x DDR5 SODIMM Slot, up to 32GB 2. Three Independent Display: 1 x HDMI 2.0b, 1 x VGA, 1 x LVDS/eDP 3. 2 x 1GbE 4. 2 x USB3.2 Gen1, 7 x USB2.0 5. 1 x M.2 2242/2280 M-key, 1 x M.2 2230 E-key, 1 x M.2 3042/3052 B-key 6. 1 x PCI, 1 x SATAIII 7. ATX Power 　Certification

3.5inch Meteor Lake Board

Blessing ENG

Preliminary Features 1. Onboard Intel® 14th Gen Core™ Ultra 7 155U (Formerly Meteor Lake-U, TDP 15W) 2. 2 x DDR5 5600MHz Dual CH SO-DIMM up to 96GB 　Certification

3.5inch Meteor Lake Board

JF35-MTU1

Preliminary Features 1. Onboard Intel® 14th Gen Core™ Ultra 7 155U (Formerly Meteor Lake-U, TDP 15W) 2. 2 x DDR5 5600MHz Dual CH SO-DIMM up to 96GB 　Certification

SoC-1335UE

MF32

3.5" SBC with Intel® 13th Generation Core™ i5-1335UE Features 1. Onboard Intel® 13th Gen Core™ i5-1335UE (Formerly Raptor Lake-P, TDP 15W) 2. 4 x Intel 2.5GbE LAN 3. Optional Dual 802.3at PoE (Max. Output 40W) 　Certification

SoC-N97

JMTX-ADN8

Mini-ITX with Intel® Processor N-series Processors (formerly Alder Lake-N) Features 1. 1 x DDR5 SODIMM Slot, up to 32GB 2. Three Independent Display: 1 x HDMI 2.0b, 1 x VGA, 1 x LVDS/eDP 3. 2 x 1GbE 4. 2 x USB3.2 Gen1, 7 x USB2.0 5. 1 x M.2 2242/2280 M-key, 1 x M.2 2230 E-key, 1 x M.2 3042/3052 B-key 6. 1 x PCI, 1 x SATAIII 7. ATX Power 　Certification

SoC-1335U

MF30

3.5″ Motherboard with Intel® 13th Gen i7/i5/i3 Processor SoC
Features

  • High-Performance Memory: 2 x DDR5 SODIMM slots, up to 64GB
  • Dual 2.5GbE: High-speed, reliable networking
  • Quad Display Support: 2 x HDMI, 2 x DP, 1 x Type-C DP, 1 x LVDS
  • Flexible Storage Expansion: 1 x SATA III, 1 x M.2 M-key (2242/2280) with NVMe support
  • Additional Expansion: 1 x E-key 2230 with CNVi, 1 x B+M-key 2242, 1 x B-key 3042 for 4G/5G
  • Comprehensive I/O: 3 x USB 3.2 Gen 2, 4 x USB 2.0, 1 x USB Type-C
  • Flexible Serial Ports: 2 x RS232/422/485, 2 x RS232
  • Wide Range Power Input: DC-in 12–36V

SoC-N97

JNUC-ADN1

NUC with Intel® Processor N-series Processors (formerly Alder Lake N) Features 1. 1 x DDR5 SODIMM Slot, up to 32GB 2. 1 x HDMI 2.0b, 1 x DP1.4, 2 x Type C DP 3. 2 x 2.5GbE 4. 4 x USB 3.2 Gen2 (2 x Type-A, 2 x Type-C DP ALT Mode), 3 x USB2 5. 1 x RS232/422/485 6. 1 x M.2 2260/2280 M-key, 1 x M.2 2230 E-key 7. DC Input 12~19V 　Certification

SoC-J6412

LZ38

Embedded board with Intel® Celeron® Processor J6412 (formerly Elkhart Lake) Features 1. 1 x DDR4 SODIMM Slot, up to 32GB 2. 1 x HDMI 2.0, 1 x LVDS or eDP 3. 2 x 2.5GbE 4. 2x USB 3.2 Gen1, 3 x USB2.0 5. 1x RS232/422/485, 1 x RS232 6. 1 x M.2 M-key 2280, 1 x M.2 E-key 2230 　Certification

SoC-J6412

LI39

Thin Mini-ITX with Intel® Celeron® Processor J6412 (formerly Elkhart Lake) Features 1. 1 x DDR4 SODIMM Slot, up to 32GB 2. 1 x HDMI 2.0b, 1 x LVDS, 1 x eDP 3. 2 x 2.5GbE 4. 4 x USB 3.2 Gen1, 5 x USB2.0 5. 2 x RS485, 4 x RS232 6. 1 x M.2 2242/2280 M-key, 1 x M.2 2230 E-key 7. 1 x PCI-E3.0 x4 　Certification

SoC-N6210

MP21

PICO-ITX with Intel® Atom® x6000E series, Celeron® N series (formerly Elkhart Lake) Features 1. LPDDR4x 4GB onboard memory 2. 1 x HDMI 2.0b, 1 x LVDS/eDP 3. 2 x GbE 4. 1 x USB 3.1 Gen2, 1 x USB3.1 Gen2 Type-C, 3 x USB2.0 5. 1 x M.2 B-key (SATA/PCIe 3.0x1/USB3.1 interface) support NVME 6. 1 x M.2 E-key (USB2.0/PCIe 3.0x1 interface) 7. 2 x COM(RS232/422/485), 1 x GPIO 8. Support RVP, OCP, and OVP design 　Certification

SoC-N97

JMTX-ADN1

Mini-ITX with Intel® Processor N-series Processors (formerly Alder Lake-N) Features 1. 1 x DDR5 SODIMM Slot, up to 32GB 2. 2 x HDMI 2.0b, 1 x Type-C DP, 1 x LVDS/eDP 3. 2 x 2.5GbE 4. 1 x USB 3.2 Gen2, 1 x USB3.2 Gen2 Type-C, 6 x USB2.0 5. 1 x RS232/422/485, 5 x RS232 6. 1 x SATAIII, 1 x M.2 2242/2280 M-key, 1 x M.2 2230 E-key, 1 x M.2 3042/3052 B-key 7. DC Input 12~28V 8. Support RVP, OCP, and OVP design 　Certification

SoC-Others

ADPIE8AIHLB

PCIe x8 Slot / 2* HAILO-8 AI processor Features 1. 2* Hailo-8™ AI processor 2. Enabling real-time, low latency and high-efficiency AI inferencing on edge devices 3. Powered by 2* 26 TOPS Hailo-8™ AI Processor with best-inclass power efficiency 4. Precautions : ADPIE8AIHLB cannot be sold separately, it must be used together with the MI3H motherboard.

SoC-Others

ADPIE8AIHLA

PCIe x8 Slot / 2* HAILO-8 AI Processor Features 1. 2* Hailo-8™ AI Processor 2. Enabling real-time, low latency and high-efficiency AI inferencing on edge devices 3. Powered by 2* 26 TOPS Hailo-8™ AI Processor with best-inclass power efficiency 4. Precautions : ADPIE8AIHLA cannot be sold separately, it must be used together with the MA3H motherboard.

Socket-H110

LA31-H110 Series

Intel® Sky Lake-S H110 chipset, supports LGA1151 CPU, On board DDR4 up to 16GB Features 1. Intel® LGA1151 Socket supports 6/7th Gen Core Processor 2. Intel® Sky Lake-S H110 3. On board 8GB DDR4 Dram (Max 16GB) 4. 1* Intel® i225-V 2.5GbE, 1* Intel® i219-LM GbE 5. 1* M.2 M-Key (2242/2280,SATAIII) 6. 4* SATA III (6Gb/s,SATA4 Co-lay M Key) 7. 1* DVI-D, 1* HDMI, Output 8. 2* RS232/422/485, 4* RS232, 4* USB3.0, 6* USB2.0 9. 16bit GPIO 10. Support Onboard TPM2.0 (option) 11. 24 + 4 Pin ATX Power Input 12. ATX Form Factor (305x220mm) 　Certification

SoC-N97

JF35-ADN1

3.5" SubCompact Board with Intel® Processor N-series Processors (formerly Alder Lake N) Features 1. 1 x DDR5 4800MHz SO-DIMM up to 32GB 2. 2 x Intel i225V 2.5GbE 3. 2 x HDMI 2.0b, 1 x eDP (co-layout LVDS), 1 x LVDS w/Inverter 4. 1 x SATAIII (6Gb/s), 6 x COM 5. 1 x USB3.2 (Gen.2) Type-A, 8 x USB2.0, 1 x USB Type-C (ALT mode) 6. 1 x M.2 M-key(2280) support NVMe, 1 x M.2 E-key(2230) support CNVi 7. Support 12~28V DC-in 8. Support RVP, OCP, and OVP design 　Certification

Socket-B760

LA34-B7600 Series

305x220mm size with 14th/13th/12th Intel® Core™ i9/i7/ i5 /i3, Celeron & Pentium® LGA1700 Socket Processor, DDR5 up to 64GB, support 3 display Features 1. Intel® 14th/13th/12th LGA1700 Socket Processor (Max.125W TDP) 2. Intel® Alder Lake-S B760 Chip 3. 2* DDR5 4800MHz UDIMM up to 64GB 4. 1* VGA, 1* HDMI, 1* DP, 1* LVDS/EDP(Option) 5. 1* 2.5GbE, 1* GbE 6. 6* COM, 6* USB3.2 (Gen.1), 6* USB2.0, 2* USB2.0 Type-A (Vertical) 7. 2* M.2 M-key (2280, NVMe, PCI-Ex2/PCI-Ex4 Interface), 1* M.2 E-key (2230, CNVi/PCI-Ex1 Interface) 8. 1* PCI-Ex16 (Gen.4), 2* PCI-Ex4 (Gen.3), 4* PCI 9. Onboard TPM2.0 (Option) 10. ATX Power 　Certification

Socket-H610E

LA34-H6100

3.5″ Motherboard with Intel® 13th Gen i7/i5/i3 Processor SoC
Features

  • High-Performance Memory: 2 x DDR5 SODIMM slots, up to 64GB
  • Dual 2.5GbE: High-speed, reliable networking
  • Quad Display Support: 2 x HDMI, 2 x DP, 1 x Type-C DP, 1 x LVDS
  • Flexible Storage Expansion: 1 x SATA III, 1 x M.2 M-key (2242/2280) with NVMe support
  • Additional Expansion: 1 x E-key 2230 with CNVi, 1 x B+M-key 2242, 1 x B-key 3042 for 4G/5G
  • Comprehensive I/O: 3 x USB 3.2 Gen 2, 4 x USB 2.0, 1 x USB Type-C
  • Flexible Serial Ports: 2 x RS232/422/485, 2 x RS232
  • Wide Range Power Input: DC-in 12–36V

SoC-J6412

LI36

Thin Mini-ITX with Intel® Celeron® Processor J6412 (formerly Elkhart Lake) Features 1. Intel® Elkhart lake J6412 SoC Processor (2.0GHz/QC) 2. 1* DDR4 3200MHz SO-DIMM up to 32GB 3. 6* 2.5 GbE (LAN3/4/5/6 Support PoE, 802.3af/at compliance) 4. 2* USB3.2 (Gen.1), 4* USB2.0 5. 4* COM (COM1: RS232 for RJ45, COM2: RS232/422/485, COM3/4: RS232) 6. 1* M.2 M-key (2242 SATA interface), 1* SATAIII 7. Onboard TPM2.0 (Option) 8. On board 64GB eMMC (Optional) 9. 12V DC-in12V DC-in 　Certification

SoC-6305E

LI35-6305E Series

Intel® 11th Tiger Lake-UP3 Core SoC Processor, DDR4 up to 32GB, 1* GbE, 1* RJ11, support triple display Features 1. Intel® 11th Tiger Lake-UP3 SoC Processor (6305E 1.8GHz/DC) 2. 1* DDR4 3200MHz SO-DIMM up to 32GB 3. 1* HDMI, 1* LVDS/eDP, 1* eDP 4. 1* Realtek® RTL8111H GbE 5. 4* USB3.2 (Gen.1), 7* USB2.0, 3* RS232, 1* RJ11 6. 1* M.2 M-key (2242/2280, PCIe x4), 1* M.2 E-key (2230), 1* SATAIII 7. Onboard TPM2.0 (Option) 8. 12-24V DC-in 　Certification

SoC-6305E

LI35-6305EL Series

Intel® 11th Tiger Lake-UP3 Core SoC Processor, DDR4 up to 32GB, 2* GbE, support triple display Features 1. Intel® 11th Tiger Lake-UP3 SoC Processor (Default: 6305E 1.8GHz/DC) 2. 1* DDR4 3200MHz SO-DIMM up to 32GB 3. 1* HDMI, 1* LVDS/eDP, 1* eDP 4. 2* Realtek® RTL8111H GbE 5. 4* USB3.2 (Gen.1), 5* USB2.0, 9* COM (COM4/5 Support RS232/422/485) 6. 1* M.2 M-key (2242/2280, PCIe x4), 1* M.2 E-key (2230), 1* SATAIII 7. Onboard TPM2.0 (Option) 8. 12-24V DC-in 　Certification

Socket-H610

LI32-H6100 Series

Intel® 14/13/12th Core i9/i7/ i5 /i3, Celeron & Pentium® LGA1700 Socket Processor, DDR5 up to 64GB, support 3 display Features 1. Intel® 14/13/12th LGA1700 Socket Processor (Max.65W TDP) 2. Intel® Alder Lake-S H610 chipset 3. 2* DDR5 5600MHz/4800MHz UDIMM up to 64GB 4. 2* HDMI, 1* VGA 5. 2* REALTEK® RTL8111H GbE 6. 4* USB3.2 (Gen.1), 8* USB2.0, 10* COM(RS232, COM1/2 Co-lay 422/485) 7. 1* M.2 M-key 2242/2280(PCI-Ex4), 1* M.2 E-key 2230, 2* SATAIII 8. Onboard TPM2.0(Option) 9. ATX Power 　Certification

SoC-1335UE

MI24

Mini-ITX Motherboard with Intel® 13th Gen Core™ i5-1335U, Wide Range DC Input Support (12-24V) Features

  • Powered by onboard Intel® 13th Gen Core™ i5-1335U (Raptor Lake-P, TDP 15W)
  • High-speed memory with 2 x DDR5 5200MHz SODIMM, supporting up to 64GB
  • Quad-display support with 2 x HDMI and 2 x Type-C DP, delivering 4K resolution
  • Dual Intel® 2.5GbE Ethernet for High Speed and Reliable Networking
  • Storage Expension: 1 x SATAIII, 1 x M.2 M-key (SATA), 1 x M.2 M-Key PCIe Gen4x4
  • Addtional Expension: 1 x PCIe 3.0x1, 1 x M.2 E-key, 1 x M.2 B-Key, and 1 SIM card Slot
  • Comprehesive I/O: 11 x USB (includes 4 USB3.2 Gen2), 6 COM Port
  • Wide Range Power support 12~24V DC-in and 4-pin header

SoC-1135G7

LE30 Series

Intel® 11th Gen. Tiger Lake-UP3 SoC Processors, M.2 PCIe 4.0 x4 support NVMe, 4* USB3.2, 2* 2.5GbE Features 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W) 2. 1* DDR4-3200MHz SO-DIMM up to 32GB 3. 2* Intel i225-V 2.5GbE 4. 1* VGA,1* HDMI2.0b, 1* eDP, 1* 24-bits LVDS 5. 2* RS232, 2* RS232/422/485, 2* USB3.2 (Gen2), 2* USB3.2 (Gen1), 2* USB2.0 6. 1* M.2 M-key (2242/2280, 1* M.2 E-key(2230), 1* M.2 B-key (3042/3052), 1* SATAIII (6Gb/s) 7. 2* Mixture Header (2* UART, 3* USB2.0, 1* LPC, 1* GPIO(8bit), 1* PCI-Ex1) 8. Onboard TPM 2.0 (option) 9. 12~24V DC-in 　Certification

SoC-Others

JADM2M2G5DL

M.2 M-key 2280 2.5GbE LAN Card Features 1. ASMEDIA ASM1806 2. 2* Intel® I225-V 2.5GbE 3. M.2 M key 2280 size

SoC-Others

JADM2ECAN

M.2 E-key 2230 CAN Card Features 1. FINTEK F81604N 2. FINTEK F81251S 3. Support 2* CAN 4. Support optical isolation ±58V 5. Industrial Temperature (-30°C to +80°C) 6. Compliant with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 7. M.2 E key 2230 size

Socket-Q470E

LI21-Q470E Series

Intel® Comet Lake-S Q470E chipset, support LGA1200 processor (Max. 65W), DDR4 up to 64GB Features 1.Intel® LGA1200 Socket supports 10/11th Gen. Core Processor (Max 65W) 2. Intel® Comet Lake-S Q470E chipset 3. 2* DDR4 3200/2933MHz up to 64GB 4. 1* Intel®i226-V 2.5GbE, 1* Intel® i219-LM GbE 5. 1* M.2 M-Key (PCI-Ex4), 1* M.2 E-Key (CNVi/PCI-Ex1/USB2.0), 1* M.2 B-Key (PCI-Ex1/USB3.2/USB2.0) 6. 1* SATA III (6Gb/s), 1* PCI-E x16 slot 7. 1* DP (Co-lay VGA), 2* HDMI, 1* LVDS/eDP Output 8. 2* RS232/422/485, 4* RS232, 6* USB3.2 (Gen1), 4* USB2.0 9. Support Onboard TPM2.0 (LI21-Q470E2, option) 10. 12-28V DC-in 11. Thin Mini-ITX Form Factor (170x170mm) 　Certification

Socket-H420E

LI21-H420E Series

Intel® Comet Lake-S H420E chipset, support LGA1200 processor (Max. 65W), DDR4 up to 64GB Features 1.Intel® LGA1200 Socket supports 10/11th Gen. Core Processor (Max 65W) 2. Intel® Comet Lake-S H420E chipset 3. 2* DDR4 2933/2666MHz up to 64GB 4. 1* Intel®i226-V 2.5GbE, 1* Intel® i219-LM GbE 5. 1* M.2 M-Key (PCI-Ex4), 1* M.2 E-Key (USB2.0/PCI-Ex1), 1* M.2 B-Key(USB3.2/USB2.0) 6. 1* SATA III (6Gb/s), 1* PCI-E x16 slot 7. 1* DP (Co-lay VGA), 2* HDMI, 1* LVDS/eDP Output 8. 2* RS232/422/485, 4* RS232, 4* USB3.2 (Gen1), 4* USB2.0 9. Support Onboard TPM2.0 (LI21-H420E2, option) 10. 12-28V DC-in 11. Thin Mini-ITX Form Factor (170x170mm) 　Certification

Socket-H610

LI25-H6100L Series

170x170mm size with 14th/13th/12th Intel® Core™ i9/i7/ i5 /i3, Celeron, Pentium® LGA1700 Socket Processor, DDR4 up to 64GB, support 3 display, 2* RJ45, 6* COM Features 1. Intel® 14th/13th/12th LGA1700 Socket Processor (Max. 65W TDP) 2. Intel® Alder Lake-S H610 Chipset 3. 2* DDR4 3200MHz UDIMM up to 64GB 4. 1* HDMI, 1* DP, 1* LVDS or eDP 5. 2* GbE 6. 2* USB3.2 (Gen.2), 2* USB3.2(Gen.1), 5* USB2.0, 6* COM 7. 1* M.2 M-key, 2242/2280(PCI-Ex4), 1* M.2 E-key, 2230, 2* SATAIII (6Gb/s) 8. Onboard TPM2.0 (Option) 9. 19V DC-in 　Certification

Socket-H610

LI25-H6100 Series

170x170mm size with 14/13/12th Intel® Core™ i9/i7/ i5 /i3, Celeron, Pentium® LGA1700 Socket Processor, DDR4 up to 64GB, support 3 display Features 1. Intel® 14/13/12th LGA1700 Socket Processor (Max. 65W TDP) 2. Intel® Alder Lake-S H610 Chipset 3. 2* DDR4 3200MHz UDIMM up to 64GB 4. 1* HDMI, 1* DP, 1* LVDS or eDP 5. 1* GbE 6. 2* USB3.2 (Gen.2), 2* USB3.2(Gen.1), 5* USB2.0, 2* RS232 7. 1* M.2 M-key, 2242/2280(PCI-Ex4), 1* M.2 E-key, 2230, 2* SATAIII (6Gb/s) 8. Onboard TPM2.0 (Option) 9. 12~19V DC-in 　Certification

Socket-Q670E

MI215Q6700 Series

Intel Q670E Chipset support LGA 1700 socket for the Intel® 14th/13th/12th Gen (Raptor Lake-S/Alder Lake-S) i9/i7/i5/i3 processor, support DDR5-4800MHz up to 96GB, Support Max. 65W TDPs under 180A Features 1. Intel® 14th/13th/12th LGA1700 Socket Processor (Max. 65W TDPs under 180A) 2. 2* DDR5 4800MHz SO-DIMM up to 96GB 3. 2* 10/100/1000/2500 Base-T Ethernet 4. 2* M.2 M-key support NVMe, 1* M.2 E-key supports CNVio, 1* M.2 B-key supports 4G/5G module, Single PCI Express x16(Gen.4) support Max. 70W 5. 2* HDMI, 2* DP, 1* LVDS/eDP support Quad displays 6. 2* RS232/422/485, 4* RS232, 4* USB3.2(Gen.2), 2* USB3.2 (Gen.1), 4* USB2.0 7. 2* SATAIII ports up to 6Gb/s support RAID 0/1 8. Support JetBIOS SW back up tool 9. Support onboard TPM2.0 option (Only MI215Q6702 Series) 10. Support wide voltage 12V~36V DC-in 11. Support RVP, OCP, and OVP design 　Certification